我们采用专用的CMP（Chemical-Mechanical Polishing）技术对蓝宝石晶片进行抛光，以较低的成本为客户提供高表面质量的蓝宝石晶片。
我们拥有各种规格的标准蓝宝石晶片库存，以确保能快速交货。每一片晶片都在100级净化间，用18 MΩ *cm以上超纯水清洗，然后装在洁净的卡塞盒。25件/盒或单片盒包装，最大限度地为客户提供研究的灵活性。
Specifications of 2英寸C面（0001）蓝宝石晶片
| Item | 2-inch C-plane(0001) 430μm Sapphire Wafers | |
| Crystal Materials | 99,999%, High Purity, Monocrystalline Al2O3 | |
| Grade | Prime, Epi-Ready | |
| Surface Orientation | C-plane(0001) | |
| C-plane off-angle toward M-axis 0.2 +/- 0.1° | ||
| Diameter | 50.8 mm +/- 0.1 mm | |
| Thickness | 430 μm +/- 25 μm | |
| Primary Flat Orientation | A-plane(11-20) +/- 0.2° | |
| Primary Flat Length | 16.0 mm +/- 1.0 mm | |
| Single Side Polished | Front Surface | Epi-polished, Ra < 0.2 nm (by AFM) |
| (SSP) | Back Surface | Fine ground, Ra = 0.8 μm to 1.2 μm |
| Double Side Polished | Front Surface | Epi-polished, Ra < 0.2 nm (by AFM) |
| (DSP) | Back Surface | Epi-polished, Ra < 0.2 nm (by AFM) |
| TTV | < 10 μm | |
| BOW | < 10 μm | |
| WARP | < 10 μm | |
| Cleaning / Packaging | Class 100 cleanroom cleaning and vacuum packaging, | |
| 25 pieces in one cassette packaging or single piece packaging. | ||
注：可依据客户需求定制生产任意晶向、厚度蓝宝石晶片。
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