8英寸蓝宝石晶片可以使芯片制造商推出更高的生产率，这将帮助他们大幅降低成本。
晶芯光电有提供8英寸epi-ready等级的蓝宝石晶片的能力，通常厚度为1300μm和1500μm。
一般来说，8英寸有一个缺口，没有定位边，当然如需要定位边，我们也是可以定制生产。我们的蓝宝石晶片在100级洁净室用18MΩ *cm超纯水清洗，然后装在洁净的卡塞盒里。
Specifications of 8英寸C面（0001）蓝宝石晶片
Item | 8-inch C-plane(0001) 1300μm Sapphire Wafers | |
Crystal Materials | 99,999%, High Purity, Monocrystalline Al2O3 | |
Grade | Prime, Epi-Ready | |
Surface Orientation | C-plane(0001) | |
C-plane off-angle toward M-axis 0.2 +/- 0.1° | ||
Diameter | 200.0 mm +/- 0.2 mm | |
Thickness | 1300 μm +/- 25 μm | |
Single Side Polished | Front Surface | Epi-polished, Ra < 0.2 nm (by AFM) |
(SSP) | Back Surface | Fine ground, Ra = 0.8 μm to 1.2 μm |
Double Side Polished | Front Surface | Epi-polished, Ra < 0.2 nm (by AFM) |
(DSP) | Back Surface | Epi-polished, Ra < 0.2 nm (by AFM) |
TTV | < 30 μm | |
BOW | < 30 μm | |
WARP | < 30 μm | |
Cleaning / Packaging | Class 100 cleanroom cleaning and vacuum packaging, | |
25 pieces in one cassette packaging or single piece packaging. | ||
注：可依据客户需求定制生产任意晶向、厚度的蓝宝石晶片。
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